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Proceedings Paper

Sulfur-free cleaning strategy for advanced mask manufacturing
Author(s): Louis Kindt; Andrew Watts; Jay Burnham; William Aaskov
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Paper Abstract

Existing cleaning technology using sulfuric acid based chemistry has served the mask industry quite well over the years. However, the existence of residue on mask surfaces is becoming more and more of a problem at the high energy wavelengths used in lithography tool for wafer manufacturing. This is evident by the emergence of sub-pellicle defect growth and backside hazing issues. A large source of residual contamination on the surface of masks is from the mask manufacturing process, particularly the cleaning portion involving sulfuric acid. Cleaning strategies can be developed that eliminate the use of sulfuric acid in the cleaning process for advanced photomasks and alternative processes can be used for cleaning masks at various stages of the manufacturing process. Implementation of these new technologies into manufacturing will be discussed as will the resulting improvements, advantages, and disadvantages over pre-existing mask cleaning processes.

Paper Details

Date Published: 20 October 2006
PDF: 10 pages
Proc. SPIE 6349, Photomask Technology 2006, 63491J (20 October 2006); doi: 10.1117/12.686228
Show Author Affiliations
Louis Kindt, IBM (United States)
Andrew Watts, IBM (United States)
Jay Burnham, IBM (United States)
William Aaskov, IBM (United States)

Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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