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Proceedings Paper

Manufacturing of the first EUV full-field scanner mask
Author(s): Uwe Dersch; Rico Buettner; Christian Chovino; Steffen Franz; Torben Heins; Holger Herguth; Jan Hendrik Peters; Thomas Rode; Florian Letzkus; Joerg Butschke; Mathias Irmscher
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Paper Abstract

In the framework of the European EXTUMASK project, the Advanced Mask Technology Center in Dresden (AMTC) has established in close collaboration with the Institute of Microelectronics in Stuttgart (IMS-Chips) an integrated mask process suited to manufacture EUV masks for the first full field EUV scanner, the ASML α-demo tool. The first product resulting from this process is the ASML set-up mask, an EUV mask designed to realize the tool set-up. The integrated process was developed based on dummy EUV blank material received from Schott Lithotec in Meiningen (Germany). These blanks have a TaN-based absorber layer and a SiO2 buffer layer. During process development the e-beam lithographic behaviour as well as the patterning performance of the material were studied and tuned to meet first EUV mask specifications. For production of the ASML set-up mask the new process was applied to a high performance EUV blank from Schott Lithotec. This blank has absorber and buffer layers identical to the dummy blanks but a multilayer is embedded which is deposited on an LTEM substrate. The actinic behaviour of the multilayer and the flatness of the substrate were tuned to match the required mask specifications. In this article we report on the development of the mask manufacturing process and show performance data of produced EUV full field scanner masks. Thereby, special attention is given to the ASML set-up mask.

Paper Details

Date Published: 20 October 2006
PDF: 14 pages
Proc. SPIE 6349, Photomask Technology 2006, 63492G (20 October 2006); doi: 10.1117/12.686035
Show Author Affiliations
Uwe Dersch, Advanced Mask Technology Ctr. (Germany)
Rico Buettner, Advanced Mask Technology Ctr. (Germany)
Christian Chovino, Advanced Mask Technology Ctr. (Germany)
Steffen Franz, Advanced Mask Technology Ctr. (Germany)
Torben Heins, Advanced Mask Technology Ctr. (Germany)
Holger Herguth, Advanced Mask Technology Ctr. (Germany)
Jan Hendrik Peters, Advanced Mask Technology Ctr. (Germany)
Thomas Rode, Advanced Mask Technology Ctr. (Germany)
Florian Letzkus, IMS-Chips (Germany)
Joerg Butschke, IMS-Chips (Germany)
Mathias Irmscher, IMS-Chips (Germany)


Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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