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Proceedings Paper

Optimization of the mechanical properties of composite materials with integrated embedded sensor networks
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Paper Abstract

The increasing demand for in-service structural health monitoring has stimulated efforts to integrate self and environmental sensing capabilities into materials and structures. To sense damage within composite materials, we are developing a compact network microsensor array to be integrated into the material. These structurally-integrated embedded microsensors render the composite information-based, so that it can monitor and report on the local structural environment, on request or in real-time as necessary. Here we present efforts to characterize the structural effects of embedding these sensors. Quasi-static three-point bending (short beam shear) and fatigue three-point bending (short beam shear) tests are conducted in order to characterize the effects of introducing sensors, or suitable dummy sensors in the form of chip resistors, and commonly used circuit board material, namely G-10/FR4 Garolite on the various mechanical properties of the host structural composite material. Furthermore, various methods and geometries of embedding the microsensors are examined in order to determine the technique that optimizes the mechanical properties of the host composite material. The work described here is part of an ongoing effort to understand the structural effects of integrating microsensor networks into a host composite material.

Paper Details

Date Published: 11 April 2006
PDF: 5 pages
Proc. SPIE 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 617443 (11 April 2006); doi: 10.1117/12.682189
Show Author Affiliations
Kristin Schaaf, Univ. of California, San Diego (United States)
Patrick Rye, Univ. of California, San Diego (United States)
Fabrizia Ghezzo, Univ. of California, San Diego (United States)
Anthony Starr, Univ. of California, San Diego (United States)
Sia Nemat-Nasser, Univ. of California, San Diego (United States)


Published in SPIE Proceedings Vol. 6174:
Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Masayoshi Tomizuka; Chung-Bang Yun; Victor Giurgiutiu, Editor(s)

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