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Proceedings Paper

Automatic pitch decomposition for improved process window when printing dense features at k1eff<0.20
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Paper Abstract

In conventional IC processes, the smallest size of any features that can be created on a wafer is severely limited by the pitch of the processing system. This approach is a key enabler of printing mask features on wafers without requiring new manufacturing equipment and with minor changes to existing manufacturing processes. The approach also does not require restrictions on the design of the chip. This paper will discuss the method and full-chip decomposition tool used to determine locations to split the layout. It will demonstrate examples of over-constrained layouts and how these configurations are mitigated. It will also show the reticle enhancement techniques used to process the split layouts and the Lithographic Checking used to verify the lithographic results.

Paper Details

Date Published: 20 May 2006
PDF: 9 pages
Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62830T (20 May 2006); doi: 10.1117/12.681853
Show Author Affiliations
Judy Huckabay, Cadence Design Systems, Inc. (United States)
Wolf Staud, Cadence Design Systems, Inc. (United States)
Robert Naber, Cadence Design Systems, Inc. (United States)
Mircea Dusa, ASML (United States)
Donis Flagello, ASML (United States)
Robert Socha, ASML (United States)

Published in SPIE Proceedings Vol. 6283:
Photomask and Next-Generation Lithography Mask Technology XIII
Morihisa Hoga, Editor(s)

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