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Proceedings Paper

Femtopulse laser-based mask repair in the DUV wavelength regime
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Paper Abstract

Deep ultraviolet (DUV) femtosecond-pulsed laser ablation has numerous highly desirable properties for subtractive photomask defect repair. These qualities include high removal rates, resolution better than the focused spot size, minimized redeposition of the ablated material (rollup and splatter), and a negligible heat affected zone. The optical properties of the photomask result in a broad repair process window because the absorber film (whether Cr or MoSi) and the transmissive substrate allow for a high degree of material removal selectivity. Repair results and process parameters from such a system are examined in light of theoretical considerations. In addition, the practical aspects of the operation of this system in a production mask house environment are reviewed from the standpoint of repair quality, capability, availability, and throughput. Focus is given to the benefit received by the mask shop, and to the technical performance of the system.

Paper Details

Date Published: 20 May 2006
PDF: 12 pages
Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 628329 (20 May 2006); doi: 10.1117/12.681779
Show Author Affiliations
Firoz Ghadiali, Intel Corp. (United States)
Vikram Tolani, Intel Corp. (United States)
Rajesh Nagpal, Intel Corp. (United States)
Tod Robinson, Rave LLC (United States)
Jeff LeClaire, Rave LLC (United States)
Ron Bozak, Rave LLC (United States)
David A. Lee, Rave LLC (United States)
Roy White, Rave LLC (United States)


Published in SPIE Proceedings Vol. 6283:
Photomask and Next-Generation Lithography Mask Technology XIII
Morihisa Hoga, Editor(s)

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