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Proceedings Paper

Simulation of dry etch profile dynamics and CD variation due to microloading
Author(s): S. Babin; K. Bay; S. Okulovsky
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Paper Abstract

Establishing parameters and tuning a dry etch process is an important task in maskmaking. Simulation should complement the time-consuming experiments to reduce cost and shorten development time. TRAVIT is a dry etch simulation tool that has been developed to simulate etch profiles, linewidths, and microloading dependent variation of critical dimensions (CD) resulting from dry etch. The software accepts GDS patterns, materials, initial resist profile, and process parameters. A mathematical model was further developed for more accurate predictions of etch profile while keeping simulation speed high to account for CD variation. Special attention was given to the footing effect. It contributes to significant CD variation if the etch time after end-point detection is not long enough. On the other hand, overetch leads to increased etch bias, which is not desirable. The simulation helps to optimize the post-etch time and minimize CD variation and bias.

Paper Details

Date Published: 20 May 2006
PDF: 7 pages
Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62831R (20 May 2006); doi: 10.1117/12.681753
Show Author Affiliations
S. Babin, Abeam Technologies (United States)
K. Bay, Abeam Technologies (United States)
S. Okulovsky, Abeam Technologies (United States)

Published in SPIE Proceedings Vol. 6283:
Photomask and Next-Generation Lithography Mask Technology XIII
Morihisa Hoga, Editor(s)

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