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Proceedings Paper

Design for manufacturability production management activity report
Author(s): Norihiko Miyazaki; T. Sato; M. Honma; N. Yoshioka; K. Hosono; T. Onodera; H. Itoh; H. Suzuki; T. Uga; K. Kadota; N. Iriki
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Paper Abstract

Design For Manufacturability Production Management (DFM-PM) Subcommittee has been started in succession to Reticle Management Subcommittee (RMS) in Semiconductor Manufacturing Technology Committee for Japan (SMTCJ) from 2005. Our activity focuses on the SoC (System On Chip) Business, and it pursues the improvement of communication in manufacturing technique. The first theme of activity is the investigation and examination of the new trends about production (manufacturer) technology and related information, and proposals of business solution. The second theme is the standardization activity about manufacture technology and the cooperation with related semiconductors' organizations. And the third theme is holding workshop and support for promotion and spread of the standardization technology throughout semiconductor companies. We expand a range of scope from design technology to wafer pattern reliability and we will propose the competition domain, the collaboration area and the standardization technology on DFM. Furthermore, we will be able to make up a SoC business model as the 45nm node technology beyond manufacturing platform in cooperating with the design information and the production information by utilizing EDA technology.

Paper Details

Date Published: 20 May 2006
PDF: 10 pages
Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 628302 (20 May 2006); doi: 10.1117/12.681729
Show Author Affiliations
Norihiko Miyazaki, Japan Electronics and Information Technology Industries Association (Japan)
Fujitsu Ltd. (Japan)
T. Sato, Japan Electronics and Information Technology Industries Association (Japan)
Toshiba Corp. (Japan)
M. Honma, Japan Electronics and Information Technology Industries Association (Japan)
NECEL (Japan)
N. Yoshioka, Japan Electronics and Information Technology Industries Association (Japan)
Renesas Technology Corp. (Japan)
K. Hosono, Japan Electronics and Information Technology Industries Association (Japan)
Renesas Technology Corp. (Japan)
T. Onodera, Japan Electronics and Information Technology Industries Association (Japan)
Oki Electric Industry Co., Ltd. (Japan)
H. Itoh, Japan Electronics and Information Technology Industries Association (Japan)
Sharp Corp. (Japan)
H. Suzuki, Japan Electronics and Information Technology Industries Association (Japan)
Sanyo Electric Co., Ltd. (Japan)
T. Uga, Japan Electronics and Information Technology Industries Association (Japan)
ROHM Co. Ltd. (Japan)
K. Kadota, Japan Electronics and Information Technology Industries Association (Japan)
Tohoku Univ. (Japan)
N. Iriki, Japan Electronics and Information Technology Industries Association (Japan)
Semiconductor Leading Edge Technologies, Inc. (Japan)


Published in SPIE Proceedings Vol. 6283:
Photomask and Next-Generation Lithography Mask Technology XIII
Morihisa Hoga, Editor(s)

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