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Proceedings Paper

Silicone materials for LED packaging
Author(s): Maneesh Bahadur; Ann W. Norris; Afrooz Zarisfi; James S. Alger; Christopher C. Windiate
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Paper Abstract

Silicone based materials have attracted considerable attention from light emitting diode (LED) manufacturers for use as encapsulants and lenses for many high brightness LED (HB LED) devices. Currently silicones function in two key roles in HB LED devices, (1) as protective lenses and (2) stress relieving encapsulants for wire bond protection. The key attributes of silicones that make them attractive as light path materials for high brightness HB LEDs include their high transparency in the UV-visible region, controlled refractive index (RI), stable thermo-mechanical properties, and tuneable modulus from soft gels to hard resins. This paper will describe recent developments in moldable silicone hard resin materials. Progress on cavity moldable and liquid injection moldable (LIM) silicone compositions for discreet components is described. Also, an example of liquid injection overmolding is presented.

Paper Details

Date Published: 12 September 2006
PDF: 7 pages
Proc. SPIE 6337, Sixth International Conference on Solid State Lighting, 63370F (12 September 2006); doi: 10.1117/12.681715
Show Author Affiliations
Maneesh Bahadur, Dow Corning Corp. (United States)
Ann W. Norris, Dow Corning Corp. (United States)
Afrooz Zarisfi, Dow Corning Corp. (United States)
James S. Alger, Dow Corning Corp. (United States)
Christopher C. Windiate, Dow Corning Corp. (United States)


Published in SPIE Proceedings Vol. 6337:
Sixth International Conference on Solid State Lighting
Ian T. Ferguson; Nadarajah Narendran; Tsunemasa Taguchi; Ian E. Ashdown, Editor(s)

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