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Proceedings Paper

Finite element analysis of thermoelastic damping in microelectromechanical systems (MEMS)
Author(s): Y.-B. Yi; M. A. Matin
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Paper Abstract

A finite element formulation is developed for solving the problem related to thermoelastic damping in MEMS beam resonators. The perturbation analysis on the governing equations of heat conduction, thermoleasticity and dynamic motion yields a linear eigenvalue equation for the exponential growth rate of nodal temperature, displacement and velocity. The numerical solutions for a simply supported beam have been obtained and compared to the analytical solutions found in literature, showing excellent agreements. The finite element formulation in this work has advantages over the existing analytical approaches in that the method can be easily extended to general three-dimensional geometries.

Paper Details

Date Published: 8 September 2006
PDF: 8 pages
Proc. SPIE 6310, Photonic Devices and Algorithms for Computing VIII, 63100T (8 September 2006); doi: 10.1117/12.679157
Show Author Affiliations
Y.-B. Yi, Univ. of Denver (United States)
M. A. Matin, Univ. of Denver (United States)


Published in SPIE Proceedings Vol. 6310:
Photonic Devices and Algorithms for Computing VIII
Khan M. Iftekharuddin; Abdul Ahad Sami Awwal, Editor(s)

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