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Proceedings Paper

Automatic inspection of small component on loaded PCB based on SVD and SVM
Author(s): Yan Wang; Yi Sun; Minghe Liu; Peng Lv; Tianjing Wu
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Paper Abstract

Automatic inspection of small components on loaded Printed Circuit Board (PCB) is difficult due to the requirements of precision and high speed. In this paper, an automatic inspection method is presented based on Singular Value Decomposition (SVD) and Support Vector Machine (SVM). For the image of loaded PCB, we use prior location of component to get approximate region of the small component. Then the accurate numeral region of the small component can be segmented by using the projection data of this region. Next, Singular Values (SVs) of the numeral region can be obtained through SVD of the gray image. These SVs are used as the features of small component to train a SVM classifier. Then, the automatic inspection can be completed by using trained SVM classifier. The method based on projection data can overcome some difficulties of traditional method using connected domain, and reduce complexity of template matching. The SVD avoids using binary image to analyze the numerals, so the numeral information is retained as much as possible. Finally, the experimental results prove that the method in this paper is effective and feasible to some extent.

Paper Details

Date Published: 25 August 2006
PDF: 8 pages
Proc. SPIE 6315, Mathematics of Data/Image Pattern Recognition, Compression, and Encryption with Applications IX, 63150P (25 August 2006); doi: 10.1117/12.678927
Show Author Affiliations
Yan Wang, Dalian Univ. of Technology (China)
Public Security Marine Police Academy (China)
Yi Sun, Dalian Univ. of Technology (China)
Minghe Liu, Dalian Univ. of Technology (China)
Peng Lv, Dalian Univ. of Technology (China)
Tianjing Wu, Dalian Univ. of Technology (China)


Published in SPIE Proceedings Vol. 6315:
Mathematics of Data/Image Pattern Recognition, Compression, and Encryption with Applications IX
Gerhard X. Ritter; Mark S. Schmalz; Junior Barrera; Jaakko T. Astola, Editor(s)

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