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Proceedings Paper

The effect of packaging process on thermal behavior of light emitting devices
Author(s): Hyungkun Kim; Yu-Sik Kim; Jaehee Cho; Jeong Wook Lee; Sukho Yoon; Kwang Hyeon Baik; Hyunsoo Kim; Cheolsoo Sone; Yongjo Park
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Paper Abstract

The acquisition of a good thermal management in LED under high flux operations is critical, which can suppress a thermal degradation and increase a lifetime of devices. LED with adopting the eutectic solder system of Sn-Ag in dieattach process has been investigated in this work. Thermal resistance of device with silver paste was 8.2 K/W, and 6.5 K/W with solder in the current study, which indicates the decrease of about 2K/W in a thermal resistance was found in the LED processed with eutectic solder in comparison to a conventional LED with Ag paste die-attach. It was observed that the LED applied with die-attach of the Sn-Ag solder showed a drastic reduction in optical power depreciation under 85oC, 350 mA operation compared to that of a conventional LED with Ag paste as well. As a result, the improvement in a thermal performance and a lifetime has been proved in this study.

Paper Details

Date Published:
PDF: 8 pages
Proc. SPIE 6337, Sixth International Conference on Solid State Lighting, 63371H; doi: 10.1117/12.678426
Show Author Affiliations
Hyungkun Kim, Samsung Advanced Institute of Technology (South Korea)
Yu-Sik Kim, Samsung Advanced Institute of Technology (South Korea)
Jaehee Cho, Samsung Advanced Institute of Technology (South Korea)
Jeong Wook Lee, Samsung Advanced Institute of Technology (South Korea)
Sukho Yoon, Samsung Advanced Institute of Technology (South Korea)
Kwang Hyeon Baik, Samsung Advanced Institute of Technology (South Korea)
Hyunsoo Kim, Samsung Advanced Institute of Technology (South Korea)
Cheolsoo Sone, Samsung Advanced Institute of Technology (South Korea)
Yongjo Park, Samsung Advanced Institute of Technology (South Korea)


Published in SPIE Proceedings Vol. 6337:
Sixth International Conference on Solid State Lighting
Ian T. Ferguson; Nadarajah Narendran; Tsunemasa Taguchi; Ian E. Ashdown, Editor(s)

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