Share Email Print
cover

Proceedings Paper

Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP)
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We demonstrated a down-hole seismic survey system that can be applied in three dimensions vertical seismic profile (VSP) detection in petroleum exploration. The results of experiments show that the system has a dynamic measurement range of 80db (ratio of maximum to minimum value) and the total delay for signal collection, process and communication is less than 200ms @ 2k bit sample rates. An array consisting of six fiber-optic accelerometers (receivers) is applied in this system. Each receiver is comprised of three fiber-optic Michelson interferometers. In order to meet the requirements of high precision and real-time measurement, the high-speed DSP chips are employed to realize the algorithms of signal filters and Phase Generated Carrier (PGC) demodulation to obtain the seismic information. Multi-ARM CPUs are introduced into the system to design the fiber-optic accelerometer array controller and the receiver array local bus that are used for real-time data communication between the multi-level receivers and controller. The system interface for traditional ELIS Down-hole Instrument Bus (EDIB) is designed by the use of FPGA so that our system can attach to EDIB and cooperate with other instruments. The design and experiments of the system are given in this paper in detail.

Paper Details

Date Published: 14 August 2006
PDF: 10 pages
Proc. SPIE 6293, Interferometry XIII: Applications, 62930W (14 August 2006); doi: 10.1117/12.678230
Show Author Affiliations
Qilin Zou, Tsinghua Univ. (China)
Liwei Wang, Tsinghua Univ. (China)
Meng Pang, Tsinghua Univ. (China)
Dongsheng Tu, Tsinghua Univ. (China)
Min Zhang, Tsinghua Univ. (China)
Yanbiao Liao, Tsinghua Univ. (China)


Published in SPIE Proceedings Vol. 6293:
Interferometry XIII: Applications
Erik L. Novak; Wolfgang Osten; Christophe Gorecki, Editor(s)

© SPIE. Terms of Use
Back to Top