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Proceedings Paper

Influence of the intermetallic compounds on the reliability of solder joints
Author(s): Przemyslaw Matkowski
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Paper Abstract

Intermetallic compounds (IMC) can not be disregard during consideration referred to the reliability of solder joints. In connection with removing lead from consumer electronics, the reliability of the Pb-free solders seems to be a crucial and worth of attention problem. Occurance of the IMC may significantly cut down the up time of interconnection causing that solder joint cracks easily. The influence of the IMC on the reliability of solder joints depends on properties of the IMC and reactions between the IMC and both boundary layers and solder mass. The IMC is not the only factor which has an effect on the reliability of solder joints. The others are for example soldering conditions, composition of alloys and layers, appearance of specific multilayers and correlations between them. In this study considerations are focused only on the IMC problems. Interfacial reactions, specific ripening of IMC and a long range interactions will be presented and explained.

Paper Details

Date Published: 26 April 2006
PDF: 6 pages
Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591V (26 April 2006); doi: 10.1117/12.675094
Show Author Affiliations
Przemyslaw Matkowski, Wroclaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 6159:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV
Ryszard S. Romaniuk, Editor(s)

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