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Proceedings Paper

High density interconnections in PCBs - an overview of plating techniques
Author(s): Janusz Borecki
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Paper Abstract

Extremely quick progress in miniaturization and functionality of electronic components more and more influences design and manufacture of Printed Circuit Boards (PCBs). Especially it concerns miniaturization and increasing of interconnection densities. The quality and reliability of manufactured interconnects depends on metallization technique. The aim of the paper is to describe the different plating techniques of High Density Interconnections (HDI) in PCBs.

Paper Details

Date Published: 26 April 2006
PDF: 9 pages
Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591U (26 April 2006); doi: 10.1117/12.675093
Show Author Affiliations
Janusz Borecki, Tele and Radio Research Institute (Poland)


Published in SPIE Proceedings Vol. 6159:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV
Ryszard S. Romaniuk, Editor(s)

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