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Proceedings Paper

Low temperature electrical properties of some Pb-free solders
Author(s): Ryszard Kisiel; Marek Pekala
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Paper Abstract

The electronic industry is engaged in developing Pb-free technologies for more than ten years. However till now not all properties of new solders are described. The aim of the paper is to present some electrical properties of new series of Pb-free solders (eutectic SnAg, near eutectic SnAgCu with and without Bi) in low temperature ranges 10 K to 273K. The following parameters were analyzed: electrical resistivity, temperature coefficient of resistance and thermoelectric power. The electrical resistivity at temperatures above 50 K is a monotonically rising function of temperature for Pb-free solders studied. The electrical resistivity of the Bi containing alloys is higher as compared to the remaining ones. The thermoelectric power values at room temperature are about -8 μV/K to -6 μV/K for Pb-free solders studied, being higher as compared to typical values -3 μVK of SnPb solder. The relatively low absolute values as well as the smooth and weak temperature variation of electrical resistivity in lead free solders enable the possible low temperature application. The moderate values of thermoelectric power around and above the room temperature show that when applying the solders studied the temperature should be kept as uniform as possible, in order to avoid spurious or noise voltages.

Paper Details

Date Published: 26 April 2006
PDF: 5 pages
Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591T (26 April 2006); doi: 10.1117/12.675092
Show Author Affiliations
Ryszard Kisiel, Warsaw Univ. of Technology (Poland)
Marek Pekala, Univ. of Warsaw (Poland)


Published in SPIE Proceedings Vol. 6159:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV
Ryszard S. Romaniuk, Editor(s)

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