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Proceedings Paper

Advanced DFM applications using design-based metrology on CD SEM
Author(s): G. F. Lorusso; L. Capodieci; D. Stoler; B. Schulz; S. Roling; J. Schramm; C. Tabery; K. Shah; B. Singh; G. Abbott; A. Roberts; A. Azordegan; L. Heinrichs; Z. Kaliblotzky; E. Castel
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Paper Abstract

Design Based Metrology (DBM) implements a novel automation flow, which allows for a direct and traceable correspondence to be established between selected locations in product designs and matching metrology locations on silicon wafers. Thus DBM constitutes the fundamental enabler of Design For Manufacturability (DFM), because of its intrinsic ability to characterize and quantify the discrepancy between design layout intent and actual patterns on silicon. The evolution of the CDSEM into a DFM tool, capable of measuring thousands of unique sites, includes 3 essential functionalities: (1) seamless integration with design layout and locations coordinate system; (2) new design-based pattern recognition and (3) fully automated recipe generation. Additionally advanced SEM metrology algorithms are required for complex 2-dimensional features, Line-Edge-Roughness (LER), etc. In this paper, we consider the overall DBM flow, its integration with traditional CDSEM metrology and the state-of-the-art in recipe automation success. We also investigate advanced DFM applications, specifically enabled by DBM, particularly for OPC model calibration and verification, design-driven RET development and parametric Design Rule evaluation and selection.

Paper Details

Date Published: 27 March 2006
PDF: 13 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61520B (27 March 2006); doi: 10.1117/12.674776
Show Author Affiliations
G. F. Lorusso, KLA-Tencor (United States)
L. Capodieci, Advanced Micro Devices, Inc. (United States)
D. Stoler, KLA-Tencor (United States)
B. Schulz, Advanced Micro Devices, Inc. (United States)
S. Roling, Advanced Micro Devices, Inc. (United States)
J. Schramm, Advanced Micro Devices, Inc. (United States)
C. Tabery, Advanced Micro Devices, Inc. (United States)
K. Shah, Advanced Micro Devices, Inc. (United States)
B. Singh, Advanced Micro Devices, Inc. (United States)
G. Abbott, KLA-Tencor (United States)
A. Roberts, KLA-Tencor (United States)
A. Azordegan, KLA-Tencor (United States)
L. Heinrichs, KLA-Tencor (United States)
Z. Kaliblotzky, KLA-Tencor (United States)
E. Castel, KLA-Tencor (United States)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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