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Proceedings Paper

Measurement of material mechanical properties in microforming
Author(s): Wang Yun; Zhenying Xu; Huang Hui; Jianzhong Zhou
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Paper Abstract

As the rapid market need of micro-electro-mechanical systems engineering gives it the wide development and application ranging from mobile phones to medical apparatus, the need of metal micro-parts is increasing gradually. Microforming technology challenges the plastic processing technology. The findings have shown that if the grain size of the specimen remains constant, the flow stress changes with the increasing miniaturization, and also the necking elongation and the uniform elongation etc. It is impossible to get the specimen material properties in conventional tensile test machine, especially in the high precision demand. Therefore, one new measurement method for getting the specimen material-mechanical property with high precision is initiated. With this method, coupled with the high speed of Charge Coupled Device (CCD) camera and high precision of Coordinate Measuring Machine (CMM), the elongation and tensile strain in the gauge length are obtained. The elongation, yield stress and other mechanical properties can be calculated from the relationship between the images and CCD camera movement. This measuring method can be extended into other experiments, such as the alignment of the tool and specimen, micro-drawing process.

Paper Details

Date Published: 9 June 2006
PDF: 5 pages
Proc. SPIE 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 61493G (9 June 2006); doi: 10.1117/12.674352
Show Author Affiliations
Wang Yun, Jiangsu Univ. (China)
Zhenying Xu, Jiangsu Univ. (China)
Huang Hui, Jiangsu Univ. (China)
Jianzhong Zhou, Jiangsu Univ. (China)


Published in SPIE Proceedings Vol. 6149:
2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Shangming Wen; Yaolong Chen; Ernst-Bernhard Kley, Editor(s)

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