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Proceedings Paper

Interferometric techniques applied in packaged MEMS and MOEMS measurement
Author(s): Sen Han
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Paper Abstract

In this paper, first of all improved techniques are described to measure packaged MEMS or MOEMS surfaces through- transmissive-media (TTM) at higher magnifications. Secondly, a universal housing is presented for TTM-objective line and for different material and thickness of glass. Finally, the measurement results for low and high magnifications will be given for dispersion-compensated objectives, as well as some MEMS application examples.

Paper Details

Date Published: 9 June 2006
PDF: 6 pages
Proc. SPIE 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 614901 (9 June 2006); doi: 10.1117/12.674188
Show Author Affiliations
Sen Han, Veeco Instruments, Inc. (United States)


Published in SPIE Proceedings Vol. 6149:
2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Shangming Wen; Yaolong Chen; Ernst-Bernhard Kley, Editor(s)

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