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Proceedings Paper

Laser propulsion of microelectronic components: releasing mechanism investigation
Author(s): Natallia S. Karlitskaya; Johan Meijer; Dirk F. de Lange; Henk Kettelarij
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Paper Abstract

Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.

Paper Details

Date Published: 7 June 2006
PDF: 10 pages
Proc. SPIE 6261, High-Power Laser Ablation VI, 62612P (7 June 2006); doi: 10.1117/12.673815
Show Author Affiliations
Natallia S. Karlitskaya, Univ. of Twente (Netherlands)
Johan Meijer, Univ. of Twente (Netherlands)
Dirk F. de Lange, Netherlands Institute for Metals Research, Univ. of Twente (Netherlands)
Henk Kettelarij, Philips Applied Technologies (Netherlands)


Published in SPIE Proceedings Vol. 6261:
High-Power Laser Ablation VI
Claude R. Phipps, Editor(s)

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