Share Email Print
cover

Proceedings Paper

Third-generation 1280 × 720 FPA development status at Raytheon Vision Systems
Author(s): D. F. King; W. A. Radford; E. A. Patten; R. W. Graham; T. F. McEwan; J. G. Vodicka; R. E. Bornfreund; P. M. Goetz; G. M. Venzor; S. M. Johnson; J. E. Jensen; B. Z. Nosho; J. A. Roth
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Raytheon Vision Systems (RVS) has developed and demonstrated the first-ever 1280 x 720 pixel dual-band MW/LWIR focal plane arrays (FPA) to support 3rd-Generation tactical IR systems under the U.S. Army's Dual-Band FPA Manufacturing (DBFM) program. The MW/LWIR detector arrays are fabricated from MBE-grown HgCdTe triple-layer heterojunction (TLHJ) wafers. The RVS dual-band FPA architecture provides highly simultaneous temporal detection in the MWIR and LWIR bands using time-division multiplexed integration (TDMI) incorporated into the readout integrated circuit (ROIC). The TDMI ROIC incorporates a high degree of integration and output flexibility, and supports both dual-band and single-band full-frame operating modes, as well as high-speed LWIR "window" operation at 480 Hz frame rate. The ROIC is hybridized to a two-color detector array using a single indium interconnect per pixel, which makes it highly producible for 20 μm unit cells and exploits mature fabrication processes currently used to produce single-color FPAs. High-quality 1280 x 720 MW/LWIR FPAs have been fabricated and excellent dual-band imagery produced at 60 Hz frame rate. The 1280 x 720 detector arrays for these FPAs have LWIR cutoff wavelengths ≥10.5 μm at 78K. These FPAs have demonstrated high-sensitivity at 78K with MW NETD values < 20 mK and LW NETD values <30 mK with f/3.5 apertures. Pixel operability greater than 99.9% has been achieved in the MW band and greater than 98% in the LW band.

Paper Details

Date Published: 17 May 2006
PDF: 15 pages
Proc. SPIE 6206, Infrared Technology and Applications XXXII, 62060W (17 May 2006); doi: 10.1117/12.673241
Show Author Affiliations
D. F. King, Raytheon Vision Systems (United States)
W. A. Radford, Raytheon Vision Systems (United States)
E. A. Patten, Raytheon Vision Systems (United States)
R. W. Graham, Raytheon Vision Systems (United States)
T. F. McEwan, Raytheon Vision Systems (United States)
J. G. Vodicka, Raytheon Vision Systems (United States)
R. E. Bornfreund, Raytheon Vision Systems (United States)
P. M. Goetz, Raytheon Vision Systems (United States)
G. M. Venzor, Raytheon Vision Systems (United States)
S. M. Johnson, Raytheon Vision Systems (United States)
J. E. Jensen, HRL Labs., LLC. (United States)
B. Z. Nosho, HRL Labs., LLC. (United States)
J. A. Roth, HRL Labs., LLC. (United States)


Published in SPIE Proceedings Vol. 6206:
Infrared Technology and Applications XXXII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

© SPIE. Terms of Use
Back to Top