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Proceedings Paper

Development of hybridized focal plane technologies
Author(s): Michael Lesser; David Ouellette
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Paper Abstract

Large area focal planes for the next generation of astronomical instruments require very flat imaging surfaces (< 10 μm peak-valley) over significant sizes (20 - 100 cm), accurate alignment of detector height, stable operation at low temperature, and fully-buttable packaging with large I/O requirements to connect multiple amplifiers per detector. These requirements are often mutually exclusive and therefore difficult to obtain in a single focal plane. In this paper we discuss the hybridization or flip chip bonding technique and associated focal plane mounting methods to achieve these goals. Specifically, we describe a technique to hybridize CCD detectors onto high thermal conductivity ceramic with vias that lead to the I/O signals underneath the detectors. Packaging methods to mount such devices with a total flatness non-uniformity of less than 10 microns are presented. The requirements of achieving sub-5 microns flatness are also discussed.

Paper Details

Date Published: 15 June 2006
PDF: 9 pages
Proc. SPIE 6276, High Energy, Optical, and Infrared Detectors for Astronomy II, 627603 (15 June 2006); doi: 10.1117/12.670808
Show Author Affiliations
Michael Lesser, Univ. of Arizona, Steward Observatory (United States)
David Ouellette, Univ. of Arizona, Steward Observatory (United States)

Published in SPIE Proceedings Vol. 6276:
High Energy, Optical, and Infrared Detectors for Astronomy II
David A. Dorn; Andrew D. Holland, Editor(s)

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