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Proceedings Paper

Dual band adaptive focal plane array: an example of the challenge and potential of intelligent integrated microsystems
Author(s): William J. Gunning; Jeffrey DeNatale; Philip Stupar; Robert Borwick; Stefan Lauxterman; Paul Kobrin; John Auyeung
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Paper Abstract

Creating intelligent integrated microsystems, devices that incorporate photonics, electronics, MEMS, and embedded intelligence, presents multiple challenges. The three device technologies have been largely developed independently and have established their own sets of design and process rules that have led to highly stable, high yield processes. In combining these technologies to achieve a desired functionality, constraints are placed on each technology to avoid adverse impacts on the others. Finding a common path towards achieving a single end objective requires process reoptimization and the development of new processes. This paper discusses the dual band adaptive focal plane array (AFPA) that is currently under development, with an emphasis on technology integration and the resulting functional benefits that can be realized. The AFPA device is a dual band IR imaging sensor that enables simultaneous collection of high-resolution MWIR imagery, with spatially independent spectrally tuned imaging in the LWIR for enhanced target detection and classification.

Paper Details

Date Published: 18 May 2006
PDF: 9 pages
Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320F (18 May 2006); doi: 10.1117/12.669724
Show Author Affiliations
William J. Gunning, Rockwell Scientific Co., LLC (United States)
Jeffrey DeNatale, Rockwell Scientific Co., LLC (United States)
Philip Stupar, Rockwell Scientific Co., LLC (United States)
Robert Borwick, Rockwell Scientific Co., LLC (United States)
Stefan Lauxterman, Rockwell Scientific Co., LLC (United States)
Paul Kobrin, Rockwell Scientific Co., LLC (United States)
John Auyeung, Rockwell Scientific Co., LLC (United States)


Published in SPIE Proceedings Vol. 6232:
Intelligent Integrated Microsystems
Ravindra A. Athale; John C. Zolper, Editor(s)

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