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Proceedings Paper

Study on influence of vibration behavior of composite material damage by holography
Author(s): Linfeng Guo; Zhimin Zhao; Mingjuan Gao; Xianzhong Zhuang
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Paper Abstract

Composite material has been applied widely in aeronautics, astronautics and some other fields due to their high strength, light weight and antifatigue and etc. But in the application, composite material may be destroyed or damaged, which may have impact on its further applications. Therefore, study on the influence of behavior of composite material damage becomes a hot research. In this paper, the common composite material for aircraft is used as the test object, and a study is conducted to investigate the influence of vibration behavior of composite material damage. The authors adopt the method of light-carrier wave and time-average holography. Compared the interference fringes of composite materials before and after damage, the width of the interference fringes of hologram of the damaged composite material is narrower than that of the fringes before. It means that the off-plane displacement of each point on the test object is larger than before. Based on the elastic mechanics theory, the off-plane displacement is inverse to the bending stiffness, and the bending stiffness of the test object will decrease after it is damaged. In other words, the vibration property of the composite material changes after damages occur. The research results of the paper show that the results accord with the analysis of theory.

Paper Details

Date Published: 20 January 2006
PDF: 7 pages
Proc. SPIE 6027, ICO20: Optical Information Processing, 60272E (20 January 2006); doi: 10.1117/12.668210
Show Author Affiliations
Linfeng Guo, Nanjing Univ. of Aeronautics and Astronautics (China)
Zhimin Zhao, Nanjing Univ. of Aeronautics and Astronautics (China)
Mingjuan Gao, Nanjing Univ. of Aeronautics and Astronautics (China)
Xianzhong Zhuang, Nanjing Univ. of Aeronautics and Astronautics (China)


Published in SPIE Proceedings Vol. 6027:
ICO20: Optical Information Processing
Yunlong Sheng; Songlin Zhuang; Yimo Zhang, Editor(s)

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