Share Email Print
cover

Proceedings Paper

Micro-optics soldering on multifunctional system platforms
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding for optoelectronical systems is introduced. Using a solder alloy that can be processed fluxless (e.g. 80Au20Sn) more functionality than pure position securing, for instance electrical connections and heat sinks for laseroptics, can be incorporated into the joint. Along with smart system platforms, made from ceramics and composites, providing the right interfaces for such functional joints a dense integration of optical and heat generating electrooptical components becomes possible.

Paper Details

Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618509 (21 April 2006); doi: 10.1117/12.667992
Show Author Affiliations
Erik Beckert, Fraunhofer Institut für Angewandte Optik und Feinmechanik (Germany)
Henrik Banse, Fraunhofer Institut für Angewandte Optik und Feinmechanik (Germany)
Ramona Eberhardt, Fraunhofer Institut für Angewandte Optik und Feinmechanik (Germany)
Andreas Tünnermann, Fraunhofer Institut für Angewandte Optik und Feinmechanik (Germany)


Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)

© SPIE. Terms of Use
Back to Top