Share Email Print

Proceedings Paper

Nano self-assembly for MEMS and microelectronics applications
Author(s): Tianhong Cui; Yuri Lvov
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper presents the combination of "bottom-up" layer-by-layer (LbL) nano self-assembly and "top-down" micromanufacturing techniques for MEMS and microelectronics applications. Two approaches, modified lift-off and metal mask, were utilized to pattern nano-assembled thin films effectively. With nano self-assembly and surface micromachining, highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was self-assembled. Self-assembled magnetic thin films on polymeric tunneling sensors were functional as a polymer actuators for the actuation of highly sensitive sensors. For microelectronics devices, self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded nano self-assembled films as dielectric and active layers were fabricated and characterized successfully as well.

Paper Details

Date Published: 7 February 2006
PDF: 7 pages
Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 603202 (7 February 2006); doi: 10.1117/12.667845
Show Author Affiliations
Tianhong Cui, Univ. of Minnesota (United States)
Louisiana Tech Univ. (United States)
Yuri Lvov, Louisiana Tech Univ. (United States)

Published in SPIE Proceedings Vol. 6032:
Masayoshi Esashi; Zhaoying Zhou, Editor(s)

© SPIE. Terms of Use
Back to Top