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Proceedings Paper

Nano self-assembly for MEMS and microelectronics applications
Author(s): Tianhong Cui; Yuri Lvov
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Paper Abstract

This paper presents the combination of "bottom-up" layer-by-layer (LbL) nano self-assembly and "top-down" micromanufacturing techniques for MEMS and microelectronics applications. Two approaches, modified lift-off and metal mask, were utilized to pattern nano-assembled thin films effectively. With nano self-assembly and surface micromachining, highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was self-assembled. Self-assembled magnetic thin films on polymeric tunneling sensors were functional as a polymer actuators for the actuation of highly sensitive sensors. For microelectronics devices, self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded nano self-assembled films as dielectric and active layers were fabricated and characterized successfully as well.

Paper Details

Date Published: 7 February 2006
PDF: 7 pages
Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 603202 (7 February 2006); doi: 10.1117/12.667845
Show Author Affiliations
Tianhong Cui, Univ. of Minnesota (United States)
Louisiana Tech Univ. (United States)
Yuri Lvov, Louisiana Tech Univ. (United States)


Published in SPIE Proceedings Vol. 6032:
ICO20: MEMS, MOEMS, and NEMS
Masayoshi Esashi; Zhaoying Zhou, Editor(s)

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