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Proceedings Paper

Nondestructive measurement of the residual stress TiN thin film coated on AISI 304 substrate by x-ray stress analyzer
Author(s): Y. K. Zhang; A. X. Feng; J. Z. Lu; D. J. Kong; C. P. Tang
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Paper Abstract

Titanium nitride films are deposited on AISI 304 steel with a hollow-cathode-discharge (HCD) ion-plating technique. The status of residual stresses in TiN thin film coated on AISI304 substrate by HCD is studied by x-ray diffraction stress analyzer. By analyzing morphology of the residual stress of TiN thin film at interface between TiN film and AISI 304 substrate, the adhering mechanism of TiN thin film is understood as follows: the mechanical interlocking had important contribution to the adhesion strength, the thermal stress is the major factor which resulting TiN thin film peeling off spontaneously. The results show that the value of thin film is -210MPa~-650Mpa, and the thermal stress is compressive, the intrinsic stress is tensile, origins of the residual stress are primarily discussed.

Paper Details

Date Published: 23 January 2006
PDF: 6 pages
Proc. SPIE 6029, ICO20: Materials and Nanostructures, 60290H (23 January 2006); doi: 10.1117/12.667681
Show Author Affiliations
Y. K. Zhang, JiangSu Univ. (China)
A. X. Feng, Jiangsu Univ. (China)
J. Z. Lu, JiangSu Univ. (China)
D. J. Kong, Jiangsu Univ. (China)
C. P. Tang, Jiangsu Univ. (China)


Published in SPIE Proceedings Vol. 6029:
ICO20: Materials and Nanostructures
Wei Lu; Jeff Young, Editor(s)

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