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Proceedings Paper

A novel soft-lithography based coupling structure for optical interconnection
Author(s): Junhao Wu; Junfeng Bao; X. Wu
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Paper Abstract

Optical interconnections on printed circuit board (PCB) holds the promise to meet an ever-increasing demand for inter-chip interconnect bandwidth, while the requirement of a stringent alignment between transmitter (normally VCSEL) and the waveguide on PCB exhibits one of obstacles that prohibit immediate implementation of optical interconnections. We demonstrate in this paper a soft lithography based coupling structure with a 0.5x0.5 mm pick-up window interfacing to VCSEL, along with a beam duct connecting to a regular waveguide. The coupling head, beam duct and the regular waveguide for chip-chip transmission were monolithically fabricated with UV-cured optical polymers through a single soft lithography process. The optical alignment was greatly eased by a factor of four comparing with conventional coupling approaches of straight waveguides. The coupling efficiency of the structure was compared with those of two prior schemes by utilizing ZEMAX, and change in transmitted pulse shape due to different beam path length was also analyzed. It was found that time delay as a result of an increased size of coupling structure was only in the order of 10-12 second, suitable for high speed communications in the range of 10Gb/s.

Paper Details

Date Published: 28 January 2006
PDF: 6 pages
Proc. SPIE 6025, ICO20: Optical Communication, 60250M (28 January 2006); doi: 10.1117/12.667012
Show Author Affiliations
Junhao Wu, Zhejiang Univ. (China)
Junfeng Bao, Zhejiang Univ. (China)
X. Wu, Zhejiang Univ. (China)

Published in SPIE Proceedings Vol. 6025:
ICO20: Optical Communication
Yun-Chur Chung; Shizhong Xie, Editor(s)

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