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Proceedings Paper

Integrated microsystems packaging approach with LCP
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Paper Abstract

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Paper Details

Date Published: 18 May 2006
PDF: 7 pages
Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320M (18 May 2006); doi: 10.1117/12.665505
Show Author Affiliations
Paul Jaynes, Harris Corp. (United States)
Lawrence W. Shacklette, Harris Corp. (United States)


Published in SPIE Proceedings Vol. 6232:
Intelligent Integrated Microsystems
Ravindra A. Athale; John C. Zolper, Editor(s)

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