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Proceedings Paper

Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board
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Paper Abstract

In this paper, laser ablation (at UGent), deep proton writing (at VUB) and laser direct writing (at HWU) are presented as versatile technologies that can be used for the fabrication of coupling structures for optical interconnections integrated on a printed circuit board (PCB). The optical layer, a highly cross-linked acrylate based polymer, is applied on an FR4 substrate. Both laser ablation and laser direct writing are used for the definition of arrays of multimode optical waveguides, which guide the light in the plane of the optical layer. In order to couple light vertically in/out of the plane of the optical waveguides, coupling structures have to be integrated into the optical layer. Out-of-plane turning mirrors, that deflect the light beam over 90°, are used for this purpose. The surface roughness and angle of three mirror configurations are evaluated: a laser ablated one that is integrated into the optical waveguide, a laser direct written one that is also directly written onto the waveguide and a DPW insert that is plugged into a cavity into the waveguiding layer.

Paper Details

Date Published: 21 April 2006
PDF: 10 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61851E (21 April 2006); doi: 10.1117/12.665387
Show Author Affiliations
Nina Hendrickx, Ghent Univ. (Belgium)
Jürgen Van Erps, Vrije Univ. Brussel (Belgium)
Himanshu Suyal, Heriot-Watt Univ. (United Kingdom)
Mohammad Taghizadeh, Heriot-Watt Univ. (United Kingdom)
Hugo Thienpont, Vrije Univ. Brussel (Belgium)
Peter Van Daele, Ghent Univ. (Belgium)


Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)

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