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Proceedings Paper

Solderability of melting lead-free solder to tiny joint of electronic products
Author(s): Fang Chen; Changhua Du; Yunfei Du
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Paper Abstract

The behavior of melting solder has an important influence on the tiny joints of electronic products. In order to improve the properties of lead-free solder, a Sn-3.5Ag0.6Cu alloy was smelted using traditional and a modified technology, respectively. The solderability of the two alloys were investigated using a wetting balance method for the different conditions. The test results showed that the modified solder had good solderability, where the excellent flux used was rosin-ethanol or rosin-isopropanol solution. In experimental condition, when the added active agent is 0.4% of rosin mass or 0.1% of solution mass, the wetting velocity and wetting force can be improved 5 times and 1.5 times, respectively. The best soldering parameters are temperature levels less than or equal to 270°, and the soakage time in 2-3s.

Paper Details

Date Published: 21 March 2006
PDF: 5 pages
Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 60402K (21 March 2006); doi: 10.1117/12.664270
Show Author Affiliations
Fang Chen, Chongqing Institute of Technology (China)
Changhua Du, Chongqing Institute of Technology (China)
Yunfei Du, Chongqing Univ. (China)

Published in SPIE Proceedings Vol. 6040:
ICMIT 2005: Mechatronics, MEMS, and Smart Materials
Yunlong Wei; Kil To Chong; Takayuki Takahashi; Shengping Liu; Zushu Li; Zhongwei Jiang; Jin Young Choi, Editor(s)

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