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Proceedings Paper

Damping characteristic analysis of MEMS inertial devices
Author(s): Yufeng Zhang; Xiaowei Liu; Weiping Chen
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Paper Abstract

The damping effects of MEMS inertial devices like micro accelerometers is studied. The damping analysis governing equation, the Reynolds equation, is the fundamental equation in this work. For small amplitude sinusoidal motions, which are governed by the linearized form of the Reynolds equation, both damping and compressibility effects are modeled numerically. Analytical solutions of the linearized Reynolds equation for micro inertial structures with various simple geometries are summarized. A procedure of solving the linearized model using typical commercial finite element analysis software is demonstrated. A numerical example of dynamical macromodel for a capacitive accelerometer indicates that viscous damping dominates at the dynamic characteristic of inertial devices. The theory and method of estimating damping effects for inertial devices with small amplitude motions are also presented. The theory is derived from the structural dynamic modal analysis and the simulation of the linearized Reynolds equation. The theoretical damping analysis equation for inertial microstructures is derived for the application of the small deflections. Simulation analysis can be used to compute the damping including the squeeze film and slip film cases. The method is applicable for general conditions, and makes it easy to make the dynamic lumped simulation model. It is useful at the beginning of the design of MEMS inertial devices affected by the damping effect.

Paper Details

Date Published: 21 March 2006
PDF: 4 pages
Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 60400E (21 March 2006); doi: 10.1117/12.664148
Show Author Affiliations
Yufeng Zhang, Harbin Institute of Technology (China)
Xiaowei Liu, Harbin Institute of Technology (China)
Weiping Chen, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 6040:
ICMIT 2005: Mechatronics, MEMS, and Smart Materials
Yunlong Wei; Kil To Chong; Takayuki Takahashi; Shengping Liu; Zushu Li; Zhongwei Jiang; Jin Young Choi, Editor(s)

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