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Proceedings Paper

Study on the packaging integrity testing for polymer micro-device
Author(s): Xiao-Peng Wang; Tian-Ning Chen; Hua-Ling Chen; Yong-fu Huang; Qiang Wei
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Paper Abstract

To test the packaging integrity of high polymer micro-device fabricated by UV-LIGA technique, a new method of non-destructive testing was presented. This method is based on conductance analysis principle of electrochemistry. Dependence on the slight change of the current value in the solution, the packaging integrity of micro-device was measured and the stability of the packaging method was evaluated. The experiment apparatus for the conductance analysis method was built, and applied to test the packaging integrity of the micro-device. The experimental results show that the presented testing method is effective to measure the packaging integrity of the micro-device.

Paper Details

Date Published: 21 March 2006
PDF: 6 pages
Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 60400A (21 March 2006); doi: 10.1117/12.664140
Show Author Affiliations
Xiao-Peng Wang, Xi'an Jiaotong Univ. (China)
Tian-Ning Chen, Xi'an Jiaotong Univ. (China)
Hua-Ling Chen, Xi'an Jiaotong Univ. (China)
Yong-fu Huang, Xi'an Jiaotong Univ. (China)
Qiang Wei, Xi'an Jiaotong Univ. (China)

Published in SPIE Proceedings Vol. 6040:
ICMIT 2005: Mechatronics, MEMS, and Smart Materials
Yunlong Wei; Kil To Chong; Takayuki Takahashi; Shengping Liu; Zushu Li; Zhongwei Jiang; Jin Young Choi, Editor(s)

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