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Proceedings Paper

A year in the life of immersion lithography at Albany Nanotech
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Paper Abstract

Immersion Lithography continues to get more and more attention as a possible solution for the 45nm technology node puzzle. In 2005, there has, indeed, been a lot of progress made. It has gone from a laboratory curiosity to being one of the industry's prime contenders for the lithography technology of choice for the 45nm node. Yet a lot of work remains to be done before it's fully implemented into production. Today, there are over a dozen full field immersion scanners in R&D and pilot lines all around the world. The first full field, pre-production "Alpha" version of the ASML Twinscan AT 1150i was delivered to Albany NanoTech in August, 2004. A consortium made up of AMD, IBM, Infineon, and Micron Technology began early evaluation of immersion technology and in December of 2004, the production of the world's first Power PC microprocessor using immersion lithography, processed on this tool, was announced by IBM. This paper will present a summary of some of the work that was done on this system over the past year. It will also provide an overview of Albany NanoTech, the facility, its capabilities, and the programs in place. Its operating model, which is heavily focused on cooperative joint ventures, is described. The immersion data presented is a review of the work done by AMD, IBM, Infineon Technologies, and Micron Technology, all members of the INVENT Lithography Consortium in place at Albany NanoTech. All the data was published and presented by the authors in much more detail at the 2005 International Symposium on Immersion Lithography, in Bruges, Belgium.

Paper Details

Date Published: 22 March 2006
PDF: 9 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 615101 (22 March 2006); doi: 10.1117/12.663785
Show Author Affiliations
Michael Tittnich, SUNY/Univ. at Albany (United States)
John G. Hartley, SUNY/Univ. at Albany (United States)
Greg Denbeaux, SUNY/Univ. at Albany (United States)
Uzo Okoroanyanwu, Advanced Micro Devices, Inc. (United States)
Harry Levinson, Advanced Micro Devices (United States)
Karen E. Petrillo, IBM Thomas J. Watson Research Ctr. (United States)
Chris Robinson, IBM (United States)
Dario Gil, IBM (United States)
Dan Corliss, IBM (United States)
David Back, Infineon Technologies (United States)
Stefan Brandl, Infineon Technologies (United States)
Christian Schwarz, Infineon Technologies (United States)
Frank Goodwin, Infineon Technologies (United States)
Yayi Wei, Infineon Technologies (United States)
Brian Martinick, Infineon Technologies (United States)
Richard Housley, Micron Technology (United States)
Peter Benson, Micron Technology (United States)
Kevin Cummings, ASML (United States)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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