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Proceedings Paper

Optical connections on flexible substrates
Author(s): Erwin Bosman; Peter Geerinck; Wim Christiaens; Geert Van Steenberge; Jan Vanfleteren; Peter Van Daele
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Paper Abstract

Optical interconnections integrated on a flexible substrate combine the advantages of optical data transmissions (high bandwidth, no electromagnetic disturbance and low power consumption) and those of flexible substrates (compact, ease of assembly...). Especially the flexible character of the substrates can significantly lower the assembly cost and leads to more compact modules. Especially in automotive-, avionic-, biomedical and sensing applications there is a great potential for these flexible optical interconnections because of the increasing data-rates, increasing use of optical sensors and requirement for smaller size and weight. The research concentrates on the integration of commercially available polymer optical layers (Truemode BackplaneTM Polymer, Ormocer®) on a flexible Polyimide film, the fabrication of waveguides and out-of plane deflecting 45° mirrors, the characterization of the optical losses due to the bending of the substrate, and the fabrication of a proof-of-principal demonstrator. The resulting optical structures should be compatible with the standard fabrication of flexible printed circuit boards.

Paper Details

Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618506 (21 April 2006); doi: 10.1117/12.663620
Show Author Affiliations
Erwin Bosman, Ghent Univ. (Belgium)
Peter Geerinck, Ghent Univ. (Belgium)
Wim Christiaens, Ghent Univ. (Belgium)
Geert Van Steenberge, Ghent Univ. (Belgium)
Jan Vanfleteren, Ghent Univ. (Belgium)
Peter Van Daele, Ghent Univ. (Belgium)


Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)

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