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Proceedings Paper

Monolithically integrated transceiver chips for bidirectional optical interconnection
Author(s): Martin Stach; Manikandan Chandran; Fernando Rinaldi; Steffen Lorch; Ihab Kardosh; Hendrik Roscher; Philipp Gerlach; Rainer Michalzik
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Paper Abstract

We report on the design, fabrication and test results of monolithically integrated transceiver chips consisting of GaAs metal-semiconductor-metal photodiodes and 850nm wavelength vertical-cavity surface-emitting lasers. These chips are well suited for low-cost and compact bidirectional optical interconnection at Gbit/s data rates in mobile systems and industrial or home networks employing large core size multimode fibers.

Paper Details

Date Published: 21 April 2006
PDF: 6 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850Q (21 April 2006); doi: 10.1117/12.662819
Show Author Affiliations
Martin Stach, Ulm Univ. (Germany)
Manikandan Chandran, Ulm Univ. (Germany)
Fernando Rinaldi, Ulm Univ. (Germany)
Steffen Lorch, Ulm Univ. (Germany)
Ihab Kardosh, Ulm Univ. (Germany)
Hendrik Roscher, Ulm Univ. (Germany)
Philipp Gerlach, Ulm Univ. (Germany)
Rainer Michalzik, Ulm Univ. (Germany)


Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)

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