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Proceedings Paper

SOI-based monolithic integration of SiON and Si planar optical circuits
Author(s): Oded Cohen; Richard Jones; Omri Raday; Alexander Fang; Nahum Izhaky; Doron Rubin; Mario Paniccia
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Paper Abstract

In recent years there has been a growing interest in using Silicon on Insulator (SOI) as a platform for integrated planar optical circuits, this is mainly due to the high quality yield volume processes demonstrated by the CMOS manufacturing industry and recent MEMS technology progress. In this work we present monolithic integration of Silicon and SiON planar lightwave circuits on a single SOI chip processed in a CMOS fabrication environment. The demonstration of a processing scheme that yields low loss waveguides for both silicon and SiON as well as efficient transition of light between the two materials is the goal of this present work. The patterning of waveguides in both silicon and SiON regions is done in a self aligned process using one lithography mask and two separate dry etch steps each highly selective to one of the two materials. The effect of a high temperature anneal on the IR absorption of SiON related N-H bond was measured using FTIR and waveguide optical loss. Up to 98% reduction in absorption is demonstrated which allows acceptable loss across the C-band. We have achieved low propagation loss, single mode, and rib waveguides for both Silicon and SiON core regions as well as low loss silicon-SiON waveguides junction. The silicon-SiON junction loss has been measured to be 0.9+/-0.1dB, only 0.3dB greater than the theoretical value determined by Fresnel's facet reflection.

Paper Details

Date Published: 20 April 2006
PDF: 7 pages
Proc. SPIE 6183, Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits, 618313 (20 April 2006); doi: 10.1117/12.662548
Show Author Affiliations
Oded Cohen, Intel Corp. (Israel)
Richard Jones, Intel Corp. (United States)
Omri Raday, Intel Corp. (Israel)
Alexander Fang, Intel Corp. (United States)
Nahum Izhaky, Intel Corp. (Israel)
Doron Rubin, Intel Corp. (Israel)
Mario Paniccia, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 6183:
Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits
Giancarlo C. Righini, Editor(s)

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