Share Email Print

Proceedings Paper

Compact triangulation sensor realized by bending wafer with metal hinge
Author(s): Minoru Sasaki; Satoshi Endou; Masayuki Fujishima; Kazuhiro Hane
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20x17x10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.

Paper Details

Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6186, MEMS, MOEMS, and Micromachining II, 618606 (21 April 2006); doi: 10.1117/12.662466
Show Author Affiliations
Minoru Sasaki, Tohoku Univ. (Japan)
Satoshi Endou, Tohoku Univ. (Japan)
Masayuki Fujishima, Tohoku Univ. (Japan)
Kazuhiro Hane, Tohoku Univ. (Japan)

Published in SPIE Proceedings Vol. 6186:
MEMS, MOEMS, and Micromachining II
Hakan Ürey; Ayman El-Fatatry, Editor(s)

© SPIE. Terms of Use
Back to Top