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Proceedings Paper

LED encapsulation: a new approach of rear light design
Author(s): S. Preuss; D. Potthoff; Th. Preuss; K. Lischka
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Paper Abstract

The dramatic increase of electronic components and devices in passenger cars tends to result in a further miniaturization of these components. In this context the chip on board technology of semiconductor devices and semiconductor light sources without extern housing and without extern optic devices gains importance. Not only the required space of further developed optoelectronic devices could be critical but also the consumption of electrical energy must be decreased. As this paper shows a direct encapsulation of Light emitting diodes (LEDs) by dint of an injection molding tool is possible. Forming the optical geometry to gain the required radiation pattern within this encapsulation process has been proofed to be feasible. In a first approach we investigated a two step encapsulation process but with the further development we ascertained a similar drop out rate for a single step encapsulation process. In particular with regard to the processing of temperature sensitive semiconductor devices specific knowledge on the thermal load is required for product life-time estimation. Therefore temperature measurement during the encapsulation process is a key point.

Paper Details

Date Published: 21 April 2006
PDF: 6 pages
Proc. SPIE 6198, Photonics in the Automobile II, 61980I (21 April 2006); doi: 10.1117/12.662422
Show Author Affiliations
S. Preuss, Univ. of Paderborn (Germany)
D. Potthoff, Univ. of Paderborn (Germany)
Th. Preuss, Univ. of Paderborn (Germany)
K. Lischka, Univ. of Paderborn (Germany)


Published in SPIE Proceedings Vol. 6198:
Photonics in the Automobile II
Patrick P. Meyrueis; Thomas P. Pearsall, Editor(s)

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