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Proceedings Paper

High-temperature LPP collector mirror
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Paper Abstract

The EUV source output power and the collector optics lifetime have been identified as critical key issues for EUV lithography. In order to meet these requirements a heated collector concept was realized for the first time. An ellipsoidal collector substrate with an outer diameter of 320 mm was coated with a laterally graded high-temperature multilayer. The interface-engineered Mo/Si multilayer coating was optimized in terms of high peak reflectivity at 13.5 nm and a working temperature of 400 °C. Barrier layers were introduced on both interfaces to block thermally induced interdiffusion processes of molybdenum and silicon to provide long-term optical stability of the multilayer at elevated temperatures. A normal-incidence reflectance of more than 40 % at 13.55 nm was measured after heating. After initial annealing at 400 °C for one hour, no degradation of the optical properties of these multilayer coatings occurred during both long-term heating tests for up to 100 hours and multiple annealing cycles. The successful realization of this high-temperature sub-aperture collector mirror represents a major step towards the implementation of the heated collector concept and illustrates the great potential of high-temperature EUV multilayer coatings.

Paper Details

Date Published: 24 March 2006
PDF: 9 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61514A (24 March 2006); doi: 10.1117/12.662138
Show Author Affiliations
Torsten Feigl, Fraunhofer IOF (Germany)
Sergiy Yulin, Fraunhofer IOF (Germany)
Nicolas Benoit, Fraunhofer IOF (Germany)
Norbert Kaiser, Fraunhofer IOF (Germany)
Norbert R. Böwering, Cymer Inc. (United States)
Alex I. Ershov, Cymer Inc. (United States)
Oleh V. Khodykin, Cymer Inc. (United States)
John W. Viatella, Cymer Inc. (United States)
Kent Bruzzone, Cymer Inc. (United States)
Igor V. Fomenkov, Cymer Inc. (United States)
David W. Myers, Cymer Inc. (United States)


Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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