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Proceedings Paper

Tapered fused bundle coupler package for reliable high optical power dissipation
Author(s): François Séguin; Alexandre Wetter; Lilian Martineau; Mathieu Faucher; Claude Delisle; Stéphane Caplette
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Paper Abstract

Light absorption in structural adhesives constitutes the main source of heat in tapered fused bundle (TFB) devices. Efficient heat dissipation solutions were developed by studying these thermal loads. The relative merits of transparent vs. opaque package designs were established experimentally. In the former, light escapes without being absorbed by the package walls, whereas in the latter, the spurious optical signal is directly absorbed and dissipated. The fact that heat is generated directly in the adhesive largely favors the opaque package, which offers more efficient heat extraction. By using a thermally conductive package, a temperature rise of 1.1°C per Watt of dissipated power was measured. These numbers demonstrate that passive heat sinking at 20°C is sufficient to allow reliable operation up to 45Watts of dissipated power (1kW with 0.2dB optical loss) without compromising long-term reliability.

Paper Details

Date Published: 23 February 2006
PDF: 10 pages
Proc. SPIE 6102, Fiber Lasers III: Technology, Systems, and Applications, 61021N (23 February 2006); doi: 10.1117/12.661254
Show Author Affiliations
François Séguin, ITF Optical Technologies (Canada)
Alexandre Wetter, ITF Optical Technologies (Canada)
Lilian Martineau, ITF Optical Technologies (Canada)
Mathieu Faucher, ITF Optical Technologies (Canada)
Claude Delisle, ITF Optical Technologies (Canada)
Stéphane Caplette, ITF Optical Technologies (Canada)

Published in SPIE Proceedings Vol. 6102:
Fiber Lasers III: Technology, Systems, and Applications
Andrew J. W. Brown; Johan Nilsson; Donald J. Harter; Andreas Tünnermann, Editor(s)

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