Share Email Print

Proceedings Paper

Thin bilayer resists approach for 193nm and future photolithography
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Resist aspect ratio has always been an issue for lithographic processes. Smaller CD forces the use of thinner resist films, but dry etch needs a certain amount of thickness in the resist. Various techniques have been proposed and researched to overcome these single-layer resist limitations. Bilayer Si-containing resists are a technique of interest and a strong candidate to replace CVD processes. In this paper, we have characterized bilayer resists and their dry-develop processes, and sought possible uses for advanced lithography, especially by using a thin film (70nm-90nm). Bilayer resist dry-develop consists of a film shrink as in an exposure reaction with an early-stage resist surface oxidation. We discuss material requirements for this purpose and provide some after-dry-develop images with small CD.

Paper Details

Date Published: 29 March 2006
PDF: 10 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61532W (29 March 2006); doi: 10.1117/12.659630
Show Author Affiliations
Yoshi Hishiro, Micron Technology, Inc. (United States)
Michael Hyatt, Micron Technology, Inc. (United States)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

© SPIE. Terms of Use
Back to Top