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Proceedings Paper

Calibrating optical overlay measurements
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Paper Abstract

The National Institute of Standards and Technology (NIST) and The International Sematech Manufacturing Initiative (ISMI) have been involved in a project to evaluate the accuracy of optical overlay measurements in the presence of measurement target asymmetries created by typical wafer processing. The ultimate goal of this project is to produce a method of calibrating optical overlay measurements on typical logic and memory production stacks. A method of performing accurate CD-SEM and CD-AFM overlay measurements is first presented. These measurements are then compared to optical overlay measurements of the same structures to assess the accuracy of the optical measurements. Novel image rotation tests were also performed on these structures to develop a method to decouple errors from metrology target asymmetries and measurement system optical asymmetries.

Paper Details

Date Published: 24 March 2006
PDF: 15 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615211 (24 March 2006); doi: 10.1117/12.659597
Show Author Affiliations
W. P. Lipscomb, International SEMATECH Manufacturing Initiative (United States)
J. A. Allgair, International SEMATECH Manufacturing Initiative (United States)
B. D. Bunday, International SEMATECH Manufacturing Initiative (United States)
M. R. Bishop, International SEMATECH Manufacturing Initiative (United States)
R. M. Silver, National Institute of Standards and Technology (United States)
R. Attota, National Institute of Standards and Technology (United States)
M. D. Stocker, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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