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Proceedings Paper

Multifunctional surface acoustic wave sensor for monitoring environmental and structural condition
Author(s): Y. Furuya; T. Kon; T. Okazaki; Y. Saigusa; T. Nomura
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Paper Abstract

As a first step to develop a health monitoring system with active and embedded nondestructive evaluation devices for the machineries and structures, multi-functional SAW (surface acoustic wave) device was developed. A piezoelectric LiNbO3(x-y cut) materials were used as a SAW substrate on which IDT(20μm pitch) was produced by lithography. On the surface of a path of SAW between IDTs, environmentally active material films of shape memory Ti50Ni41Cu(at%) with non-linear hysteresis and superelastic Ti48Ni43Cu(at%) with linear deformation behavior were formed by magnetron-sputtering technique. In this study, these two kinds of shape memory alloys SMA) system were used to measure 1) loading level, 2) phase transformation and 3)stress-strain hysteresis under cyclic loading by utilizing their linearity and non-linearity deformation behaviors. Temperature and stress dependencies of SAW signal were also investigated in the non-sputtered film state. Signal amplitude and phase change of SAW were chosen to measure as the sensing parameters. As a result, temperature, stress level, phase transformation in SMA depending on temperature and mechanical damage accumulation could be measured by the proposed multi-functional SAW sensor. Moreover, the wireless SAW sensing system which has a unique feature of no supplying electric battery was constructed, and the same characteristic evaluation is confirmed in comparison with wired case.

Paper Details

Date Published: 31 March 2006
PDF: 11 pages
Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61720Q (31 March 2006); doi: 10.1117/12.659536
Show Author Affiliations
Y. Furuya, Hirosaki Univ. (Japan)
T. Kon, Hirosaki Univ. (Japan)
T. Okazaki, Hirosaki Univ. (Japan)
Y. Saigusa, River Eletec Corp. (Japan)
T. Nomura, Shibaura Institute of Technology (Japan)


Published in SPIE Proceedings Vol. 6172:
Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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