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Proceedings Paper

Versatility in lithographic performance of advanced 193 nm contact hole resist
Author(s): Takanori Kudo; Guanyang Lin; Dongkwan Lee; Dalil Rahman; Allen Timko; Douglas Mckenzie; Clement Anyadiegwu; Simon Chiu; Frank Houlihan; David Rentkiewicz; Ralph R. Dammel; Munirathna Padmanaban; John Biafore
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Paper Abstract

This paper introduces high performing contact hole resist targeting 65 nm node and below IC applications. Both 80 nm and 100 nm contact hole performance are evaluated under optimized condition by ProlithTM simulations and the advantage of the shrinking technique (RELACSTM) is discussed for 65 nm node. The functionality of 193 nm polymers and the influence of resist components on lithographic performance are described with experimental design. The optimized resist, AZ® AX2050P is versatile in lithographic performance with large process window, excellent resist profile, good contact circularity and sidewall roughness. Its unusual PEB sensitivity property, resist pattern thermal flow behavior and performance with RELACSTM material are also reported. AZ® AXTM2050P has a high resolution combined with a large depth of focus and an iso-dense overlap window with RELACSTM R602 [85 nm CD (NA 0.85) DOF 0.30 μm @ Exposure latitude 8%].

Paper Details

Date Published: 29 March 2006
PDF: 9 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61532C (29 March 2006); doi: 10.1117/12.659439
Show Author Affiliations
Takanori Kudo, AZ Electronic Materials USA Corp. (United States)
Guanyang Lin, AZ Electronic Materials USA Corp. (United States)
Dongkwan Lee, AZ Electronic Materials USA Corp. (United States)
Dalil Rahman, AZ Electronic Materials USA Corp. (United States)
Allen Timko, AZ Electronic Materials USA Corp. (United States)
Douglas Mckenzie, AZ Electronic Materials USA Corp. (United States)
Clement Anyadiegwu, AZ Electronic Materials USA Corp. (United States)
Simon Chiu, AZ Electronic Materials USA Corp. (United States)
Frank Houlihan, AZ Electronic Materials USA Corp. (United States)
David Rentkiewicz, AZ Electronic Materials USA Corp. (United States)
Ralph R. Dammel, AZ Electronic Materials USA Corp. (United States)
Munirathna Padmanaban, AZ Electronic Materials USA Corp. (United States)
John Biafore, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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