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Proceedings Paper

Self assembly in semiconductor microelectronics: self-aligned sub-lithographic patterning using diblock copolymer thin films
Author(s): C. T. Black; R. Ruiz
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Paper Abstract

Self-assembling diblock copolymer thin films are an intriguing possible photolithography alternative for high-resolution patterning of advanced integrated circuit device elements. Cylindrical- and lamellar-phase materials spontaneously form patterns suggestive of contact-hole arrays and transistor gates at critical dimensions below 20nm. Besides high resolution, any serious lithographic process requires a means of pattern registration, and we discuss our efforts to develop self-aligned self assembly techniques using diblock copolymer materials. We describe the critical role of polymer surface interactions in affecting self-assembled pattern orientations. Control and design of surface properties allow precise registration of sub-20nm polymer domains to larger-scale lithographic layers.

Paper Details

Date Published: 13 March 2006
PDF: 11 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615302 (13 March 2006); doi: 10.1117/12.659252
Show Author Affiliations
C. T. Black, IBM Thomas J. Watson Research Ctr. (United States)
R. Ruiz, IBM Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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