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Proceedings Paper

Nickel electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS
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Paper Abstract

This work investigates both DC and pulse electroplating techniques for nickel. A nickel sulfamate electrolyte is utilized for nickel deposition over Cu/Ti coated silicon substrates. Stress levels and grain morphology are investigated and analyzed for the electroplated nickel deposit. A comparison is also made between the results obtained from DC and from long and short duration pulse electroplating techniques. Both compressive and tensile built-in stresses are observed in both DC and long duration pulse plated nickel while only compressive stresses are observed in short duration pulse plated nickel.

Paper Details

Date Published: 31 March 2006
PDF: 10 pages
Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61720E (31 March 2006); doi: 10.1117/12.659104
Show Author Affiliations
Tinghui Xin, Louisiana State Univ. (United States)
Pratul K. Ajmera, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 6172:
Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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