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Proceedings Paper

Self-assembled Metal Rubber mechanical sensors
Author(s): Richard O. Claus; Richard M. Goff; Jennifer H. Lalli; Andrea Hill
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Paper Abstract

Molecular-level self-assembly processes allow the formation of novel materials with properties that are not achievable using conventional fabrication methods. For example, nanostructured metals and polymers may be combined to form inorganic/organic materials that exhibit properties typically associated with each of these species separately, namely high electrical conductivity and low Young's modulus. The combination of such properties is of interest for a number of engineering applications. For example, methods to form stretchable metal conductors, either on elastomeric substrates or as free-standing materials, have been investigated for some time, in part as a way to overcome the high modulus of sensor and actuator electrode materials, and more generally to address the need for mechanically flexible interconnections in polymer electronic devices, flex circuits, electronic textiles and similar electrical circuit applications. Of particular recent interest for example is summarized in [1] where a process to form electrical connectivity using 100 nm-wide gold stripes evaporated onto polydimethylsiloxane (PDMS) is reported, and where non-zero electrical conductivity was observed for strains up to 22%.

Paper Details

Date Published: 30 March 2006
PDF: 4 pages
Proc. SPIE 6167, Smart Structures and Materials 2006: Smart Sensor Monitoring Systems and Applications, 616712 (30 March 2006); doi: 10.1117/12.658809
Show Author Affiliations
Richard O. Claus, Virginia Polytechnic Institute and State Univ. (United States)
NanoSonic, Inc. (United States)
Richard M. Goff, Virginia Polytechnic Institute and State Univ. (United States)
NanoSonic, Inc. (United States)
Jennifer H. Lalli, NanoSonic, Inc. (United States)
Andrea Hill, NanoSonic, Inc. (United States)


Published in SPIE Proceedings Vol. 6167:
Smart Structures and Materials 2006: Smart Sensor Monitoring Systems and Applications
Daniele Inaudi; Wolfgang Ecke; Brian Culshaw; Kara J. Peters; Eric Udd, Editor(s)

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