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Proceedings Paper

193 nm resist composition using hybrid copolymers of cycloolefin/maleic anhydride (COMA)/methacrylate
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Paper Abstract

A high performance 193 nm resist has been developed from a novel hybrid copolymer based on a cycloolefin-maleic anhydride and methacrylate (COMA/Methacrylate) polymer system. A variety of copolymers have been synthesized from t-butyl norbornene carboxylate (BNC), t-butyl tetracyclo[4.4.0.1. 2,617,10] dodec-8-ene-3-carboxylate (TCDBC), t-butoxycarbonylmethyl tetracyclo[4.4.0.1.2,617,10]dodec-8-ene-3-carboxylate (BTCDC), and 5-[2-trifluoromethyl-1,1,1-trifluoro-2-hydroxypropyl]-2-norbornene (F1) and maleic anhydride (MA). The effect of the monomers and the ratio of monomers in the copolymer on lithographic performance studied. This paper will report the chemistry of the polymer platform and relative advantages and disadvantages of having certain monomers in terms of lithographic performance and line edge roughness, and post exposure bake sensitivity.

Paper Details

Date Published: 11 April 2006
PDF: 8 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615327 (11 April 2006); doi: 10.1117/12.658671
Show Author Affiliations
M. Dalil Rahman, AZ Electronic Materials (United States)
Srivanisan Chakrapani, AZ Electronic Materials (United States)
Clement Anyadiegwu, AZ Electronic Materials (United States)
Guanyang Lin, AZ Electronic Materials (United States)
Allen Timko, AZ Electronic Materials (United States)
Frank Houlihan, AZ Electronic Materials (United States)
David Rentkiewicz, AZ Electronic Materials (United States)
Takanori Kudo, AZ Electronic Materials (United States)
Douglas McKenzie, AZ Electronic Materials (United States)
Ralph Dammel, AZ Electronic Materials (United States)
Munirathna Padmanaban, AZ Electronic Materials (United States)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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