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Proceedings Paper

Transfer function characterization of thermally-actuated displacement-amplified micro-electromechanical systems (MEMS)
Author(s): Timothy Reissman; Ephrahim Garcia; Nicolae Lobontiu; Yoonsu Nam
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Paper Abstract

In this paper the dynamics of MEMS devices is explored, which characterizes the behavior of a thermally-actuated MEMS in order to perform a system identification enabling controlled operation of the micro-device. By considering the input to the system is the current/voltage and the output is the amplified mechanical displacement, a transfer function, TF, is derived which includes energy losses due to the imperfect energy conversion from electric to thermal, and which correspond to various phenomena, such as convection, radiation and conduction - accounting for a Joule-effect temperature less than the ideal one. This TF also includes the relationship between temperature and the mechanical deformation of both "active and passive" flexure hinges, which are thermally-actuated and which contribute to the kinematics of the output motion of the micro-device. This TF model is validated by means of experimental data from an actual displacement-amplification MEMS which was fabricated by means of the PolyMUMPs surface machining technology.

Paper Details

Date Published: 31 March 2006
PDF: 12 pages
Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61721B (31 March 2006); doi: 10.1117/12.658590
Show Author Affiliations
Timothy Reissman, Cornell Univ. (United States)
Ephrahim Garcia, Cornell Univ. (United States)
Nicolae Lobontiu, Technical Univ.of Cluj-Napoca (Romania)
Yoonsu Nam, Kangwon National Univ. (South Korea)

Published in SPIE Proceedings Vol. 6172:
Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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