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Proceedings Paper

Modeling of non-uniform device geometries for post-lithography circuit analysis
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Paper Abstract

Current ORC and LRC tools are not connected to design in any way. They are pure shape-based functions. A wafer-shape based power and performance signoff is desirable for RET validation as well as for "closest-to-silicon" analysis. The printed images (generated by lithography simulation) are not restricted to simple rectilinear geometries. There may be other sources of such irregularities such as Line Edge Roughness (LER). For instance, a silicon image of a transistor may not be a perfect rectangle as is assumed by all current circuit analysis tools. Existing tools and device models cannot handle complicated non-rectilinear geometries. In this paper, we present a novel technique to model non-uniform, non-rectilinear gates as equivalent perfect rectangle gates so that they can be analyzed by SPICE-like circuit analysis tools. The effect of threshold voltage variation along the width of the device is shown to be significant and is modeled accurately. Taking this effect into account, we find the current density at every point along the device and integrate it to obtain the total current. The current thus calculated is used to obtain the effective length for the equivalent rectangular device. We show that this method is much more accurate than previously proposed approaches which neglect the location dependence of the threshold voltage.

Paper Details

Date Published: 14 March 2006
PDF: 10 pages
Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 61560U (14 March 2006); doi: 10.1117/12.658087
Show Author Affiliations
Puneet Gupta, Blaze DFM Inc. (United States)
Andrew Kahng, Blaze DFM Inc. (United States)
Youngmin Kim, Univ. of Michigan, Ann Arbor (United States)
Saumil Shah, Univ. of Michigan, Ann Arbor (United States)
Dennis Sylvester, Univ. of Michigan, Ann Arbor (United States)


Published in SPIE Proceedings Vol. 6156:
Design and Process Integration for Microelectronic Manufacturing IV
Alfred K. K. Wong; Vivek K. Singh, Editor(s)

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